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Results 1 to 25 of 2075

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Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO2 reductionMYEONGJIN KIM; MYEONGYEOL YOO; YOUNGJAE YOO et al.Microelectronics and reliability. 2014, Vol 54, Num 3, pp 587-594, issn 0026-2714, 8 p.Article

2 MeV electron irradiation effects on the electrical characteristics of metal―oxide―silicon capacitors with atomic layer deposited Al2IO3, HfO2 and nanolaminated dielectricsRAFI, J. M; CAMPABADAL, F; GOMEZ, A et al.Solid-state electronics. 2013, Vol 79, pp 65-74, issn 0038-1101, 10 p.Article

Effect and extraction of series resistance in Al2O3-InGaAs MOS with bulk-oxide trapYU, B; YUAN, Y; CHEN, H.-P et al.Electronics letters. 2013, Vol 49, Num 7, pp 492-493, issn 0013-5194, 2 p.Article

On the validity of unintentional doping densities extracted using Mott―Schottky analysis for thin film organic devicesNIGAM, Akash; PREMARATNE, Malin; NAIR, Pradeep R et al.Organic electronics (Print). 2013, Vol 14, Num 11, pp 2902-2907, issn 1566-1199, 6 p.Article

Voltage and current stress induced variations in TiN/HfSixOy/TiN MIM capacitorsMISRA, D; KASINATH, Jyothi; CHANDORKAR, Arun N et al.Microelectronics and reliability. 2013, Vol 53, Num 2, pp 270-273, issn 0026-2714, 4 p.Article

Distribution of deep-level traps at atomic-layer-deposited Al2O3/n-GaN interfaceDAWEI YAN; HAI LU; DUNJUN CHEN et al.Solid-state electronics. 2012, Vol 72, pp 56-59, issn 0038-1101, 4 p.Article

Investigations on electrical characteristics and reliability properties of MOS capacitors using HfAlOx on n-GaAs substratesDAS, P. S; BISWAS, Abhijit.Microelectronics and reliability. 2012, Vol 52, Num 1, pp 112-117, issn 0026-2714, 6 p.Article

MIM Capacitors With Crystalline-TiO2/SiO2 Stack Featuring High Capacitance Density and Low Voltage CoefficientWU, Yung-Hsien; OU, Wei-Yuan; LIN, Chia-Chun et al.IEEE electron device letters. 2012, Vol 33, Num 1, pp 104-106, issn 0741-3106, 3 p.Article

Nanostructured Barrier Type Anodic Oxide Metal-Insulator-Metal CapacitorsKANNADASSAN, D; KARTHIK, R; MARYAM SHOJAEI BHAGINI et al.Journal of nanoelectronics and optoelectronics. 2012, Vol 7, Num 4, pp 400-404, issn 1555-130X, 5 p.Article

Accurate Nanoliter Liquid Characterization Up to 40 GHz for Biomedical Applications: Toward Noninvasive Living Cells MonitoringTONG CHEN; DUBUC, David; POUPOT, Mary et al.IEEE transactions on microwave theory and techniques. 2012, Vol 60, Num 12, pp 4171-4177, issn 0018-9480, 7 p., 2Article

Leakage current conduction behaviors of 0.65 nm equivalent-oxide-thickness HfZrLaO gate dielectricsLIN, K. C; CHEN, J. Y; HSU, H. W et al.Solid-state electronics. 2012, Vol 77, pp 7-11, issn 0038-1101, 5 p.Conference Paper

High-Performance Metal-Insulator-Metal Capacitor Using Stacked TiO2/Y2O3 as InsulatorWU, Yung-Hsien; LIN, Chia-Chun; HU, Yao-Chung et al.IEEE electron device letters. 2011, Vol 32, Num 8, pp 1107-1109, issn 0741-3106, 3 p.Article

Transient current mechanism of lead zirconate titanate capacitors sputtered on La0.65Sr0.35MnO3MINGZHI DAI; MINGMING LI; GUODONG WU et al.Microelectronics and reliability. 2011, Vol 51, Num 5, pp 925-926, issn 0026-2714, 2 p.Article

Frequency Effect on Voltage Linearity of ZrO2-Based RF Metal-Insulator-Metal CapacitorsBERTAUD, Thomas; BLONKOWSKI, Serge; BERMOND, Cédric et al.IEEE electron device letters. 2010, Vol 31, Num 2, pp 114-116, issn 0741-3106, 3 p.Article

High-Performance MIM Capacitors Using Novel PMNT Thin FilmsWENBIN CHEN; MCCARTHY, Kevin G; MATHEWSON, Alan et al.IEEE electron device letters. 2010, Vol 31, Num 9, pp 996-998, issn 0741-3106, 3 p.Article

Reconfigurable ECO Cells for Timing Closure and IR Drop MinimizationCHEN, Hsien-Te; CHANG, Chieh-Chun; HWANG, Tingting et al.IEEE transactions on very large scale integration (VLSI) systems. 2010, Vol 18, Num 12, pp 1686-1695, issn 1063-8210, 10 p.Article

Electrical Properties of Bi5Nb3O15 Thin Film Grown on TiN/SiO2/Si at Room Temperature for Metal-Insulator-Metal CapacitorsCHO, Kyung-Hoon; SEONG, Tae-Geun; CHOI, Joo-Young et al.IEEE electron device letters. 2009, Vol 30, Num 6, pp 614-616, issn 0741-3106, 3 p.Article

Structural and Electrical Properties of Mn-Doped Bi4Ti3O12 Thin Film Grown on TiN/SiO2/Si Substrate for RF MIM CapacitorsCHOI, Joo-Young; KANG, Lee-Seung; CHO, Kyung-Hoon et al.I.E.E.E. transactions on electron devices. 2009, Vol 56, Num 8, pp 1631-1636, issn 0018-9383, 6 p.Article

Effect of Oxygen Pressure on the Electrical Properties of Bi5Nb3O15 Films Grown by RF Magnetron SputteringCHO, Kyung-Hoon; CHOI, Chang-Hak; CHOI, Joo-Young et al.IEEE electron device letters. 2008, Vol 29, Num 9, pp 984-987, issn 0741-3106, 4 p.Article

Effects of the metal gate on the stress-induced traps in Ta2O5/SiO2 stacksATANASSOVA, E; PASKALEVA, A; NOVKOVSKI, N et al.Microelectronics and reliability. 2008, Vol 48, Num 4, pp 514-525, issn 0026-2714, 12 p.Article

Fabrication of Perovskite-Based High-Value Integrated Capacitors by Chemical Solution DepositionSIGMAN, Jennifer; BRENNECKA, Geoffrey L; CLEM, Paul G et al.Journal of the American Ceramic Society. 2008, Vol 91, Num 6, pp 1851-1857, issn 0002-7820, 7 p.Article

Influence of carbon structure on performance of electrode material for electric double-layer capacitorYANSU WANG; CHENGYANG WANG; CHUNYU GUO et al.The Journal of physics and chemistry of solids. 2008, Vol 69, Num 1, pp 16-22, issn 0022-3697, 7 p.Article

Influence of residual thermal stresses and geometric parameters on stress and electric fields in multilayer ceramic capacitors under electric biasJIANG, Wu-Gui; FENG, Xi-Qiao; NAN, Ce-Wen et al.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 13, issn 0022-3727, 135310.1-135310.6Article

Mechanism of capacitance aging under DC-bias field in X7R-MLCCsTSURUMI, Takaaki; SHONO, Motohiro; KAKEMOTO, Hirofumi et al.Journal of electroceramics. 2008, Vol 21, Num 1-4, pp 17-21, issn 1385-3449, 5 p.Conference Paper

Water-induced degradation in BaTiO3-based barrier layer capacitorsWEN CHAO YOU; WAN PING CHEN; WANG XIANG et al.Journal of electroceramics. 2008, Vol 21, Num 1-4, pp 202-205, issn 1385-3449, 4 p.Conference Paper

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